LOADING INSPECTION METHOD

摘要

PURPOSE:To precisely decide the form of chip parts and the quality of a mounting direction as to the chip parts which are surface-loaded on a wiring board by means of solder. CONSTITUTION:The positions of the corners of contourines in the chip parts are decided based on three-dimensional form data in the surface-loaded chip parts 1 (steps 102 and 103). A primary regression operation is executed based on the coordinates of plural points on a side where solder 2 is not given among respective sides in adjacent corners at the contour lines, and the inclination angle theta of the side is obtained (step 104). The quality of the loading direction is decided based on the obtained inclination angle theta (step 110).