| 摘要 |
PURPOSE:To obtain a semiconductor device high in heat dissipating efficiency by a method wherein a part of a package is interposed between the outer periphery of a semiconductor chip and the ends of leads, and a conductor layer smaller in thermal conductivity than a package is formed. CONSTITUTION:Inner leads used in common are arranged between an IC chip 51 and the ends of input-output signal inner leads 24-28 and 30-38 connected to wires. The surface of the inner leads concerned is set nearly level with that of the other lead 24 or the like. The inner leads are used in common as conductor layers arranged in radial paths to the semiconductor chip 1, a part of a package, the input-output signal inner lead 24 and the like, whereby the heat dissipating path of a semiconductor device of this design can be lessened in thermal resistance as the device is small in thermal conductivity as compared with a conventional resin package. |
