发明名称 SUBSTRATE
摘要 PURPOSE:To avoid the blotting of liquid constituent such as a solvent etc., contained in the bond coated on a land thereby obviating the defective bonding due to the blotting. CONSTITUTION:Within the title substrate wherein electrodes 4 are provided leaving insulating spaces 5 around the land whereto a bare chip P is bonded 2, an insulating partitioning wall 6 encircling the bond 2 is protruded on the insulating spaces 5.
申请公布号 JPH0521633(A) 申请公布日期 1993.01.29
申请号 JP19910172544 申请日期 1991.07.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAMI SEIJI
分类号 H01L21/60;H01L23/12 主分类号 H01L21/60
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