| 摘要 |
<p>PURPOSE:To provide a circuit board where a wiring conductor and a circuit conductor can be clad with an improved adhesion property by enhancing electrical conductivity between the two. CONSTITUTION:In a circuit substrate where a circuit conductor 4 which consists of copper is clad on an outer surface of an insulation substrate 1 where a wiring conductor 2 which consists of at least one type out of tungsten, molybdenum, and manganese so that it partially contacts a wiring conductor, a middle metal layer 3 which contains a molybdenum of 1-10.0wt.%, a cobalt of 0.01-10.0wt.%, and a phosphor of 0.01-20.0wt.% in nickel is included at a contact portion between the wiring conductor 2 and the circuit conductor 4. The wiring conductor 2 and the circuit conductor 4 are clad with an improved adhesion property by the middle metal layer 3 and electrical conduction between the wiring conductor 2 and the circuit conductor 4 is extremely superior.</p> |
