| 摘要 |
<p>PURPOSE:To prevent soldering failure such as non-soldered parts or solder bridges from occurring by a method wherein outer terminal leads extending from the sides of a resin sealed type semiconductor device are bent outward into the same shape with a J lead or nearly the same. CONSTITUTION:An external terminal lead 3 connected to a semiconductor chip is provided extending from a resin sealed part 2 of a semiconductor device 1, and the TAB lead 3 is formed into a semicircle near a support ring 5 provided, protruding from the resin sealed part 2. Furthermore, a rod-shaped polyimide film 6 is fixed to the tips of the outer terminal leads 3 to keep them fixed. The semiconductor device 1 provided with the outer leads 3 processed as mentioned above is mounted on a printed wiring board 21 and soldered to it with a heating melting jig 23 provided with a heat releasing body.</p> |
