| 摘要 |
PURPOSE:To decrease the number of through holes and via holes, thereby to improve the reliability of a circuit board by connecting opposite lands electrically through an isotropic conductor sheet. CONSTITUTION:Circuit patterns 5 and 6 are formed on a circuit board 11, while circuit pattern 7 and 8 are formed on a circuit board 12. The circuit boards 11 and 12 are provided with corresponding lands 6c and 7c facing each other to connect the circuit patterns 6 and 7. In the circuit board 11 is provided a via hole 10 having a plating 10a. Resist is applied over the opposed surfaces of the circuit boards 11 and 12 except the areas corresponding to the lands and through hole. A through hole 14 is opened in an isotropic conductor sheet 13 where it does not face the land 6c or 7c. The sheet 13 is laminated on the circuit board 12, and the hole 14 is filled with adhesive 15. The circuit board 11 is laminated on the sheet 13, and the whole laminate is heated under pressure to harden the adhesive 15. |
