Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin

摘要

Adhesive tape for tape automated bonding (TAB) has an organic insulating film with an adhesive coating covered by a protective film. The adhseive coating is (a) a layer contg. a polyamide resin (I) with amine number = at least 3 and an epoxide resin (IIA), (b) a layer contg. (I) and a powdered inorganic filler (III), (c) a layer contg. an expoxide resin (IIB) with a siloxane structure in its main chain, and (d) a layer contg. a maleimide resin (IV). Pref. (I) has Mw = (a) 2000-150000, (b) 20000-150000; softening point = (a) 50-180, (b) 100-180 deg. C and amine number = pref. (a) 5-50. (III) has an average particle size of 0.1-30 microns and is used in (b) in an amt. of 1-90%. (IIB) has a main chain consisting partly or entirely of a siloxane structure, which may be linear, branched and/or cyclic. ADVANTAGE - The tape has good chemical and thermal stability before use and high adhesion, does not impair the insulation and is non-corrosive.