<p>A base board for a printed circuit board having a printed circuit formed from a copper foil on an insulating layer, the insulating layer containing a compound of the formula (1) or a compound of the formula (2). <CHEM></p>
申请公布号
EP0524744(A1)
申请公布日期
1993.01.27
申请号
EP19920306246
申请日期
1992.07.08
申请人
MITSUBISHI GAS CHEMICAL COMPANY, INC.
发明人
ISHII, KENJI;KONDO, YOSHINORI C/O TOKYO WORKS OF MITSUBISHI;MATSUMOTO, HIROYUKI;SAYAMA, NORIO
