发明名称 |
Method of making dynamic random access memory cell having a SDHT structure |
摘要 |
A SDHT structured DRAM Cell with a P type silicon substrate and a P well region with a first trench formed into the P well region and a CVD oxide film layer formed on the wall of the first trench is disclosed. A second trench is formed in the bottom of the first trench. A capacitive oxide film layer is formed on the CVD oxide film layer of the first trench and on the second trench with a conducting material filling the trenches to form an inside charge storage electrode. A N MOSFET is formed on the P well region near the first trench with the N MOSFET having a soure N+ region and a drain N+ region, each including a LDD region.
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申请公布号 |
US5182224(A) |
申请公布日期 |
1993.01.26 |
申请号 |
US19910641621 |
申请日期 |
1991.01.16 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
发明人 |
KIM, JAE W.;CHUNG, IN S. |
分类号 |
H01L21/334;H01L21/8242;H01L29/94 |
主分类号 |
H01L21/334 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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