| 摘要 |
<p>PURPOSE:To prevent separation of an adhesive material and damage of an IC module, etc., occurring due to bending of an IC card. CONSTITUTION:A recessed part is formed on one surface of a card base material 1, and a cushioning member 12 is fixed on the bottom surface of the recessed part by an adhesive material 13. An IC module 2 is fixed on the cushioning member 12 by an adhesive 11. At the center of the adhesives 11, 13 and the cushioning member 12, a rectangular window is provided, and a resin molded part 23 is fitted in this window. When a bending force is added to an IC card 10, bending stress is absorbed by the cushioning member 12, and therefore, the bending stress which is applied to the adhered part and IC module 2 is reduced.</p> |
