| 摘要 |
PURPOSE:To enable to perform the easy assembling and alignment of a microscopic semiconductor device and the like by a method wherein a semiconductor chip is attracted, held and shifted by an electrostatic-charged jig. CONSTITUTION:For instance, one end 15 of a rod 14 of quartz, hard glass, Pyrex glass or the like of approximately 5mm. phi in diameter and 50mm. length is machined into a tapered shape of 15mm. length, and a flat section 16 having a diameter of about 600mum is formed at the pointed end. As for the material of the rod 14, materials other than those aforementioned may be used, if static electricity can be induced and they are not softened at a temperature of several hundred degrees. And the tapered section 18 at the pointed section is machined in such way that it is vertical to the bottom face, thereby allowing an easy performance of press-fitting of a semiconductor chip on a substrate 21. The jig thus machined is electrified using, for example, an acryl resin plate, a semiconductor chip 27 or the like is attracted and the assembling, positioning and the like of the semiconductor are performed. As a jig material, a transparent one is suited for use in positioning. |
