发明名称 Metal silicide texturizing technique
摘要 In the present invention, a stable and uniform texturized surface of a conductive structure is developed by annealing, oxidizing and etching a layer of metal silicide that has been deposited over a semiconductive material. Using this process during fabrication of memory cell in a DRAM will increase storage node capacitance by creating texturized capacitor cell plates that will retain their textured surfaces throughout implementation of conventional DRAM fabrication processes.
申请公布号 US5182232(A) 申请公布日期 1993.01.26
申请号 US19910793031 申请日期 1991.11.15
申请人 MICRON TECHNOLOGY, INC. 发明人 CHHABRA, NAVJOT;SANDHU, GURTEJ S.
分类号 H01L21/02;H01L27/108 主分类号 H01L21/02
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