发明名称 OLEFINIC RESIN COMPOSITION FOR COMPRESSION MOLDING
摘要 PURPOSE:To provide a composition which gives a lightweight molding in which the mechanical properties of the resin material can be retained or partially improved. CONSTITUTION:An olefinic resin composition for compression molding which is prepared by mixing an olefin resin material of a melt flow rate of 20-50 with 10-30wt.% glass balloons having an average particle diameter of 30-70mum and an average particle density of 0.4-0.6g/cc and is placed in a molten state in a mold and compression-molded.
申请公布号 JPH0517634(A) 申请公布日期 1993.01.26
申请号 JP19910193661 申请日期 1991.07.09
申请人 MEIWA IND CO LTD 发明人 SAITO ICHIRO;USHIKI HARUMI
分类号 B29C43/02;B29K23/00;B29K105/04;C08K7/00;C08K7/28;C08L23/02 主分类号 B29C43/02
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