发明名称 |
MANUFACTURE OF COMPOSITE MOLDED PRODUCT USING THERMOSETTING POLYURETHANE |
摘要 |
PURPOSE:To enhance the bonding properties and adhesiveness between respective members by compounding a specific numerical value pts.wt. of an organosilicon compound with 100 pts.wt. of a resin constituting a first member. CONSTITUTION:A composite molded product is obtained by integrally combining a second member constituted of thermosetting polyurethane obtained by reacting an active hydrogen-containing compound and a polyisocyanate compound with a first member 3 composed of a resin same to or different from a polyurethane resin. At this time, 0.01-10 pts.wt. of an organosilicon compound 30 represented by YRSiX3 (wherein X is the hydrolyzable group 32 bonded to a silicon atom, R is an alkyl group and Y is an organically reactive group) is compounded with 100 pts.wt. of the resin constituting the first member 3. |
申请公布号 |
JPH0516174(A) |
申请公布日期 |
1993.01.26 |
申请号 |
JP19910170067 |
申请日期 |
1991.07.10 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
NISHIYAMA HIDEMI;UCHIDA HIROSHI |
分类号 |
B29C45/00;B29C45/14;B29C45/16;B29K75/00;C08K5/54;C08K5/5419;C08L75/00;C08L75/04 |
主分类号 |
B29C45/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|