METHOD FOR THE MANUFACTURE OF A MULTIPLE LAYER LAMINATE FOR THE PREPARATION OF PRINTED CIRCUIT BOARDS

摘要

Electrodeposited planar resistive layers comprising nickel.sulfur and chromium.carbon.oxygen composites (10) are provided. The planar resistors may be combined with conductive layers (10) and insulative layers (12) to produce laminates (10) useful in the preparation of printed circuit boards. The resistive layers (16) are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive such as oxygen, carbon and/or sulfur. The planar resistors have sheet resistances in the range of from about 15 to about 1000 OMEGA per square.