| 摘要 |
PURPOSE:To provide a lead frame which shows a high separability of a lead frame rim, particularly, from the resin hardened at a gate zone of the lower die in resin molding of the lead frame by using a resin of high adhesiveness. CONSTITUTION:A metal layer 21 such as of nickel or zinc inferior in adhesiveness with the mold resin is formed on a lead frame rim 6. A location for its formation should be, at least, a zone where the rim crosses a gate 14 of the lower die 10 for resin-molding a semiconductor pellet 2 mounted on this lead frame. |
