| 摘要 |
PURPOSE:To prevent a short circuit between a wire and another lead and improve electrical reliability, by forming an insulator being higher than a face of the second lead and placed between the first lead and an external terminal of a semiconductor pellet. CONSTITUTION:In a resin sealing-type semiconductor device 1 employing a lead-on-chip(LOC) structure, each inner lead 3A is electrically connected with an external terminal 2A of a semiconductor pellet 2 through a wire 5. An insulator 6 is formed higher than a face of the second lead(power supply common lead)3C and provided between the first lead(inner lead)3A and the external terminal 2A of the semiconductor pellet 2. Then, with the support of the insulator 6, the power supply common lead 3C is electrically separated from the wire 5, which is extended over the power supply common lead 3C for connecting the inner lead 3A and external terminal 2A. Consequently, a short circuit between the wire 5 and the power supply common lead 3C can be prevented. |
