| 摘要 |
PURPOSE:To sufficiently cool a wafer while reducing foreign matters to be adhered to a rear surface of the wafer. CONSTITUTION:A wafer 7 is approached to a cooling plate 15 by holding pins 5 group held in a point contact state, and cooling air 14 is blown to the wafer 7 in a near state to cool the wafer. Thus, since the wafer 7 is held in the point contact state, foreign matters to be adhered to the rear surface of the wafer are reduced. Since the wafer 7 is cooled by the plate 15 and the air 14, it is effectively cooled. |
