| 摘要 |
PURPOSE:To improve heat dissipation property by having a high thermal conductive material layer and a thin film multilayered wiring layer and by forming a plurality of thermal vias filled with a high thermal conductive material layer in the thin film multilayered wiring layer. CONSTITUTION:A ceramic multilayered substrate 2 having input/output pins 1 is overlaid with an insulative high thermal multilayered material layer made of diamond, which is then overlaid with a thin film multilayered wiring layer 4 by coating-with a polyimide resin or by repeating overlay with a spin coat and a wiring layer. This thin film. multilayered wiring layer 4 is copper-plated in an opening provided in the thickness direction or is provided with a plurality of thermal vias 5 melt-cast with a high thermal conductive low melting point. It is overlaid with a metal layer 6 for mounting a semiconductor integrated circuit chip; further, a semiconductor integrated circuit chip 7 is faceup-mounted, where its electrodes are connected with bonding wires 8 to predetermined wiring layers of the thin film multilayered wiring layer 4. |
