| 摘要 |
PURPOSE:To provide a treatment device which flexibly deals with enlargement of a size of a transfer jig such as a wafer cassette, automatic transfer, etc., restrains an attachment amount of dust to an object to be treated and improves through-put. CONSTITUTION:A device is provided with a treatment part 2 which has a plurality of treatment units 11a to 11f and a carrying path unit 12 through which sesmiconductor wafers are transferred to and from the treatment units 11a to 11f, a loader part 3 which has a cassette mount part 14 containing a wafer cassette 13 and a carrying mechanism 15 for transferring semiconductor wafers 10 to and from the wafer cassette 13, and a delivery mechanism for delivering the semiconductor wafer 10 between the carrying path unit 12 and the transfer mechanism 15. The carrying path unit 12 and the carrying mechanism 15 are arranged to a T-shape. |
