| 摘要 |
PURPOSE:To provide a multilayer wiring circuit board which can be easily manufactured at a low cost. CONSTITUTION:The edge of a multilayer circuit board composed of a board 1 of ceramic, a printed layer insulating film 2 of polyimide, and conductor wiring 3 formed through a sputtering method is stepped, and the conductor wirings located at the exposed edge of the board 1 are electrically connected together with an Au bonding wire 6. By this setup, an interlayer connection operation used in this circuit board can be executed easier than a conventional case where a viahole is employed. |
