SOLID LITHOGRAPHIC METHOD DEPOSITING THREE-DIMENSIONAL ARTICLE AND CURING COMPOSITION

摘要

PURPOSE: To make it possible to impart toughness and non-embrittlement post- curing characteristic and to maintain a high curing rate by using a thiol-nene compd. of a photosetting resin system having low shrinkability in place of acrylate having high shrinkability. CONSTITUTION: This method consists of a stage for curing the curable liquid resin compd. until articles are completely deposited by each subsequent layer pattern of the bath of this compd., then removing the articles from the liquid resin bath and subjecting the articles to post-curing. The compding of the liquid resin consists of (a) a first compd. having plural thiol groups thereon, (b) a second compd. having the plural thiol groups therein and (c) a free group photoinitiator and the total functionality of the compounding is >=4.