| 摘要 |
<p>PURPOSE:To improve the reliability and production yield of a chip carrier which airtightly seals a semiconductor chip mounted on a package substrate with a cap. CONSTITUTION:A chip carrier is formed by face-down bonding a semiconductor chip 3 on a package substrate 2 through a CCB bump 6 and TAB leads 9 and airtightly sealing the chip 3 by soldering a cap 4 to the substrate 2, and then, soldering the rear surface of the chip 3 to the lower surface of the cap 4.</p> |
