| 摘要 |
PURPOSE:To lessen the ratio of the overall thickness of a package to the total sum thickness of a semiconductor element and a die pad in a thin type package which is dimensionally limited in its thicknesswise direction. CONSTITUTION:A step part 4 is provided to the outer peripheral part of a semiconductor element 1, and a frame-like die pad 5 formed of only a frame correspondent to the above step part 4 is combined with the step part 4 concerned so as to enable the element 1 to be fixed. At this point, the step part is inserted into a hole 6 of the frame 5.
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