发明名称 |
MANUFACTURE OF SIP TYPE ELECTRONIC PART |
摘要 |
PURPOSE:To provide low price lead frames for use in manufacturing SIP type electronic parts. CONSTITUTION:By using a lead frame composed of a low price supporting plate for feed 2 of high strength and low price combs 3 of the smallest size to obtain the suitability for a lead of electronic parts, a batch manufacturing system and continuous lead frame system which are highly efficient and require strength. |
申请公布号 |
JPH0513634(A) |
申请公布日期 |
1993.01.22 |
申请号 |
JP19910165450 |
申请日期 |
1991.07.05 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TAKADA KINJI |
分类号 |
H01C17/28;H01G13/00;H01L23/50 |
主分类号 |
H01C17/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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