| 摘要 |
PURPOSE:To make a semiconductor device a multichip-type device with good productivity by mounting the plurality of semiconductor chips on one face of a TAB tape in the longitudinal direction of the TAB tape and by bending the TAB tape zigzag for locating the semiconductor chips in three dimensions and then by sealing the TAB tape and the semiconductor chips with resin. CONSTITUTION:A TAB tape 1 is, for instance, a polyimide- or other material- made base film 2 having copper foil-formed leads 3 for electrode extraction formed on its surface. On one surface of the TAB tape 1, the plurality of semiconductor chips 4a, 4b having the leads 3 connected with electrodes 5 are placed in the longitudinal direction of the TAB tape 1. Then, the TAB tape is bent zigzag so that the semiconductor chips 4a, 4b may be placed on a region above one chip and may be eventually located in three dimensions. Under such a condition, the TAB tape 1 and the semiconductor chips are sealed. By this method, the device can be made to be a multichip-type one without increasing an occupation area and the degree of integration of the device can be increased. |
