发明名称 HYBRID INTEGRATED CIRCUIT DEVICE
摘要 <p>PURPOSE:To obtain a hybrid integrated circuit device in which a variation in a signal level and an erroneous operation are eliminated when a weak signal of a low voltage level is used in a place having many disturbance noises by providing a shielding pattern on a surface of an organic board at the opposite side to a passive element and active element placing surface. CONSTITUTION:Circuit patterns 2a, 2b are provided on an organic board 1a via a through hole 7. Then, a shielding pattern 9 of a copper foil having a predetermined thickness is adhered through a board 1b to the rear surface by a high pressure, high temperature press by using a multilayer technique of printed boards. Then, a passive element 3 and an active element 4 are placed on the front surface, and circuit-connected by using fine metal wirings 5. Further, after it is sealed with sheath resin 6, outer leads 6 are heated and connected by using solder as an outer terminal, the shielding pattern is connected to the predetermined outer lead 8 to prevent disturbance noise from the rear surface. Thus, the noise is prevented, an S/N ratio can be improved, and an erroneous operation can be prevented.</p>
申请公布号 JPH0513897(A) 申请公布日期 1993.01.22
申请号 JP19910166551 申请日期 1991.07.08
申请人 NEC CORP 发明人 KOMIYAMA TOSHIO
分类号 H01L23/14;H01L25/04;H01L25/18;H05K1/00;H05K1/02;H05K1/18;H05K3/28 主分类号 H01L23/14
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