JOINT OF SEMICONDUCTOR DEVICE CHIP AND HEAT DISSIPATING MEMBER AND MANUFACTURE THEREOF

摘要

PURPOSE:To provide a joint of a semiconductor device chip and a heat dissipating member, where a soldering material is hardly attached to the device chip to cause a short circuit. CONSTITUTION:In a joint of a semiconductor laser chip 2 and a heat sink 6 to fix them together interposing a bonding pad 1 between them, the bonding pad 1 is provided with a gap located between the non-electrode part 3 and the semiconductor laser chip 2 and formed at least partially covering the non- electrode part 3.