| 摘要 |
PURPOSE:To provide a method wherein an optical semiconductor element is fixed and bonded to the center of an optical semiconductor element support face on a stem simply, quickly and with high accuracy regarding improvement of the method wherein the optical semiconductor element is fixed and bonded to the central part of the stem in an optical semiconductor element package. CONSTITUTION:The title manufacturing method is constituted in the following manner: a brazing material 9 is melted and placed on a support face 3 on a stem, for optical semiconductor element package use, provided with a support member 1 wherein the support face 3 supporting an optical semiconductor element 2 is formed at its upper part and a through hole 10 is formed in the central part; the optical semiconductor element 2 is placed in a floating manner on the brazing material 9 in a molten state; then, the brazing material 9 in the molten state is sucked via the through hole 10, cooled and solidified; and the optical semiconductor element 2 is fixed and bonded to the central part of the support face 3.
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