| 摘要 |
PURPOSE:To provide an IC for auto-focus(AF) capable of obtaining a high distance measurement accuracy by using a small-sized chip. CONSTITUTION:The image of an object projected by way of a pair of separator lenses is imaged on two photo-sensor arrays 1a. Two IC chips 1 built-in with a pair of photo sensor arrays 1a are arrayed with an interval right and left so that they may be mounted with die pads 2a and 2b of a lead frame 2 intended for a point eye triangle/passive type auto-focus(AF) IC which measures the distance to an object from a differential phase of the image. When they are assembled, the first one out of the two IC chips are die-bonded on the lead frame. Then, the second one is temporarily bonded thereon. Under this condition, a pattern image of each photo sensor array 1a is reflected on a CCD area sensor by an optical process. |
