Heating block for semiconductor chip wire bonding machine - has inner heating stage and chip heating stage at two different temps.

摘要

The heating block has an inner heating stage (12), for bonding one end of each wire with each inner conductor of a lead frame. A chip heating stage (13) bonds the opposite ends of the wires to a semiconductor chip. The inner heating stage is heated to a higher temp. than the chip heating stage. Pref. a differential heating device (30) has an opening (16) in the centre of the inner heating stage into which the chip heating stage is fitted. The latter is made of a material with a lower thermal conductivity than the heating block (10) for the inner heating stage. ADVANTAGE - Prevents damage to semiconductor chip during bonding.