MOISTURE RELIEF FOR CHIP CARRIERS

摘要

An integrated circuit package (10) comprises a semiconductor die (14) having a top surface and a bottom surface, and a substrate (16) for receiving the semiconductor die. The substrate should have an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. An adhesive (20) applied to the substrate allows for mounting the semiconductor die to the substrate. Then, the semicondcutor die is wirebonded to the substrate. Finally, an encapsulant (12) for sealing the top surface of the semiconductor die is formed over the semiconductor die and portions of the substrate.