| 摘要 |
<p>A wafer mounting device wherein a wafer coated with an adhesive on the surface, can be pasted on a mount plate while maintaining the thickness of an adhesive layer uniform. At the top of the arm, a chuck plate is disposed in such a way that it can be moved in a direction of rotation of the arm. This chuck plate is heated by a heater to the substantially same temperature as the wafer. Between the chuck plate and the arm are provided, a pressing pad for biasing the chuck plate in a direction being away from the arm, and a pressure-adjusting pad for biasing the chuck plate in a direction being close to the chuck plate. The pressing pad and the pressure-adjusting pad are formed to have hollow sections within which pressurizing fluids are supplied, thereby controlling the pressing force of the chuck plate so that the wafer is placed softly on the mount plate. <IMAGE></p> |
