Boards for high frequency circuits.

摘要

A board for high frequency circuits, comprising: a resin sheet comprising an ultra high molecular weight polyethylene and a cured curable resin dispersed in the ultra high molecular weight polyethylene; a reinforcing layer on at least one side of the resin sheet, the reinforcing layer comprising a reinforcing material impregnated with a cured curable resin; and a metal conductor layer on the reinforcing layer; wherein a halogenated organic compound having symmetric structure is dispersed in at least one of the resin sheet and the reinforcing layer.