HEAT SINK, METHOD OF MANUFACTURING THE SAME, AND DEVICE OF MANUFACTURING THE SAME

摘要

The heat sink (3) is mounted on a semiconductor chip module sealed hermetically with a cap (4). The heat sink (3) comprises an absorption means (3a) for absorbing the heat generated from a semiconductor chip (6), being inserted into an opening formed (4a) in a cap (4) so as to make contact with a semiconductor chip (6) sealed hermetically within a semiconductor chip module; a heat dissipation means (3c) exposed outside the cap (4) for dissipating the heat of the semiconductor chip (6) absorbed by the absorption means (3a); and a contact surface (a of 3b) disposed between the absorption means (3a) and the heat dissipation means (3c) and fixed on the upper surface of the cap (4), and the contact surface (a of 3b) at least being coated with an adhesive material (S). The heat sink (3) mounted on a semiconductor chip module can stably dissipate the heat produced from a semiconductor chip (6) sealed hermetically within the semiconductor chip module.