| 摘要 |
PURPOSE:To reduce the number of processes and to easily replace a semiconductor chip or a circuit board. CONSTITUTION:Bumps 13, 13 on a semiconductor chip 12 are brought into pressure-contact with electrode parts 16, 16 on a circuit board 15 by using an elastic material 11; leg parts of the elastic material 11 are bonded to the circuit board 15 by a thermoplastic adhesive; the semiconductor chip 12 is mounted temporarily on the circuit board 15. The chip is inspected in this state; after that, a photo resin 19 is injected into a space inside the elastic material 11 which has been bonded to the circuit board 15; the semiconductor chip 12 is sealed; at the same time, the semiconductor chip 12 is mounted formally on the circuit board 15. When the semiconductor chip 12 is inspected in a temporarily mounted state and the chip or the circuit board 15 is defective, the temporarily mounted chip is removed and a defective product can be replaced easily. The chip is mounted formally and sealed simultaneously, and the number of processes can be reduced. |
