| 摘要 |
<p>PURPOSE:To connect a semiconductor chip facedown to a wiring board in an electrically stable state. CONSTITUTION:An aluminum pad 16 which has been connected to a circuit inside a semiconductor chip 15 is connected to an electrode pad 14 which has been fixed to a wiring board 11. The electrode pad 14 is led to the inside; after that, it is connected to an pattern 20 on the opposite side of the insulating board 11. The wiring pattern 20 is connected to an wiring pattern 12 via a through hole 21.</p> |
