| 摘要 |
PURPOSE:To easily and effectively mirror-finish a bevel surface formed on an edge of a semiconductor wafer. CONSTITUTION:An apparatus for manufacturing a semiconductor wafer to mirror-finish a bevel surface 2c formed on an edge of the wafer 2, comprises a rotating unit 11 for rotating the wafer 2 by holding it in a state of crossing a horizontal axis, and a polishing unit 15 so disposed as to be brought into contact with the surface 2c of the wafer 2 held by the unit 11 and having a polishing cloth 14 adhered to the surface of the contact part with the surface 2c to polish the surface 2c. |
