MANUFACTURE OF SHIELDING PLATE FOR MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To provide a manufacturing method, wherein the manufacturing process of a shielding plate is further simplified compared to a conventional manufacturing process and it is made possible to solve effectively also various troubles at the time of manufacture of a printed wiring board, of the shielding plate for multilayer printed wiring board. CONSTITUTION:Roll laminators for laminating respectively bonding agents 6 with a copper foil on both surfaces of internal layer circuit boards 3 are shown and these laminators respectively unwind the bonding agents 6 with a copper foil from small wound rolls 7a and 7b made by winding continuours bonding agents 6 with a copper foil in a roll-form and respectively laminate the bonding agents 6 on both surfaces of the boards 3 while the bonding agents 6 are made to insert between heating rolls 8a and 8b.