| 摘要 |
PURPOSE:To enable polishing of an Si wafer with high precision and prevent a decrease in the polishing precision and the occurrence of polishing deficiency. CONSTITUTION:A wafer retaining carrier 1 having a wafer receiving hole 2 is provided, on its underside 1a, with abrasive agent introduction grooves 3, 4 extending from an outer side surface 1c to the wafer receiving hole 2. The upper surface of this wafer retaining carrier 1 is contacted, via a backing material, with a pressurizing head and, in this condition, the carrier 1 is mounted to the head. This enables high precision polishing of an Si wafer and enables preventing a decrease in the polishing precision and insufficient polishing. |
