| 摘要 |
Bonded refractory compsn. contains a conductive material, pref. homogeneously distributed Cu, Ag, Au, Ni, Mo, W, Nb and/or Ta metals, alloys and/or mixts. Pref. the compsn. comprises phosphate-bonded Si carbide, Si nitride and/or Al nitride contg. Cu (alloy), opt. together with a filler and an organic concrete fluidiser selected from methyl cellulose, Na or Ca ligninsulphonate, dextrin, and polyacrylate polymers. USE/ADVANTAGE - Compsn. is useful as a mortar esp. for bonding refractory structures such as tube shields and blocks to boiler tube systems. |
