| 摘要 |
PURPOSE:To obtain a photoresist compsn. having excellent sensitivity and resolution which can be enough used for any structure of a photosensitive resin component, by incorporating a resin component such as polyimide precursor and a compd. which can induce the isolation reaction of a protective group with irradiation of active ray. CONSTITUTION:The heat-resistant positive photoresists composition contains a resin component having a structural unit expressed by formula I and a compd. which becomes basic with irradiation of active ray. The bond shown as an arrow indicates a bond which can be replaced by isomerization, and R1 and R2 are quadrivalent or bivalent aromatic or aliphatic hydrocarbon residues. Further, this composition is applied on a supporting body to obtain a photosensitive film comprising the photosensitive base material and the resin compsn. This film is irradiated with active ray through a photomask, heated, and treated to remove the exposed area with an alkali developer. |
