| 摘要 |
PURPOSE:To increase the bonding strength of a resist film to an object to be patterned and to enhance the resolution of an etching operation. CONSTITUTION:An object 1, to be patterned, to which a resist film 2 in a prescribed pattern has been applied is heated up to the melting temperature of the resist film 2 via a hot plate. When the temperature on the side of the resist film 2 of the hot plat has reached the melting temperature, the object 1 to be patterned is cooled quickly. Thereby, since the interface between the resist film 2 and the object 1 to be patterned is heated up to the meling temperature of the resist film 2, the part on the side of the interface of the resist film 2 is changed to a glass and bonded strongly to the object 1 to be patterned. When the resist film 2 is heated up to its melting temperature, the object 1 to be patterned is cooled quickly. As a result, the resist film 2 is not deformed. |
