METHOD AND DEVICE FOR MEASURING A SEMICONDUCTOR ELEMENT WITH BUMPS, AND METHOD AND DEVICE FOR MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

A method for sufficiently measuring and evaluating the electrical characteristics of a semiconductor element mounted using a flip-chip bonding method comprises the steps of preparing a measuring substrate for measuring the electrical characteristics of the semiconductor element; holding the semiconductor element with the circuit surface facing the measuring substrate; positioning the bumps with respect to the contact positions of the measuring substrate, where the bumps of the semiconductor element are connected; connecting the bumps to the contact positions by way of anisotropic conductive member; and measuring the electrical characteristics of the semiconductor element by energizing the measuring substrate.