发明名称 |
ELECTRONIC CIRCUIT PACKAGE |
摘要 |
An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chips packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayer. The bus line includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate. <IMAGE> |
申请公布号 |
EP0501474(A3) |
申请公布日期 |
1993.01.13 |
申请号 |
EP19920103361 |
申请日期 |
1992.02.27 |
申请人 |
HITACHI, LTD. |
发明人 |
KANEKAWA, NOBUYASU;IHARA, HIROKAZU;AKIYAMA, MASATSUGU;YAMANAKA, HISAYOSHI;OKISHIMA, TETSUYA;KAWABATA, KIYOSHI |
分类号 |
G06F1/18;G06F3/00;G06F11/10;G06F11/22;G06F12/16;G06F15/78;G11C5/00;H01L23/495;H01L23/50;H01L23/538;H01L25/04;H01L25/065;H01L25/18 |
主分类号 |
G06F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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