GOLD PLATING BATH ADDITIVES FOR COPPER CIRCUITIZATION ON POLYIMIDE PRINTED CIRCUIT BOARDS,申请号EP19920101373-传众专利搜索

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发明名称	GOLD PLATING BATH ADDITIVES FOR COPPER CIRCUITIZATION ON POLYIMIDE PRINTED CIRCUIT BOARDS
摘要
申请公布号	EP0497286(A3)	申请公布日期	1993.01.13
申请号	EP19920101373	申请日期	1992.01.28
申请人	INTERNATIONAL BUSINESS MACHINES CORPORATION	发明人	KEIM, LEANN G.;PAONESSA, RALP S.;VANHART, DANIEL C.
分类号	C25D3/48;H01L21/48;H01L23/12;H05K3/24;(IPC1-7):C25D3/48;H05K3/42	主分类号	C25D3/48
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