发明名称 |
Cylindrical magnetron sputtering system |
摘要 |
A system for depositing a film on a substrate includes a sputtering system and means for causing the substrate to move through the sputtering system. Embodiments of the present invention employ a cylindrical hollow cathode magnetron sputtering system, which causes the overall film deposition system to be ideally suited for coating elongate cylindrical substrates such as wires and fibers and the like.
|
申请公布号 |
US5178743(A) |
申请公布日期 |
1993.01.12 |
申请号 |
US19910649311 |
申请日期 |
1991.01.30 |
申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION |
发明人 |
KUMAR, NALIN |
分类号 |
C23C14/34;C23C14/56;H01J37/34;H01L39/24 |
主分类号 |
C23C14/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|