发明名称 Cylindrical magnetron sputtering system
摘要 A system for depositing a film on a substrate includes a sputtering system and means for causing the substrate to move through the sputtering system. Embodiments of the present invention employ a cylindrical hollow cathode magnetron sputtering system, which causes the overall film deposition system to be ideally suited for coating elongate cylindrical substrates such as wires and fibers and the like.
申请公布号 US5178743(A) 申请公布日期 1993.01.12
申请号 US19910649311 申请日期 1991.01.30
申请人 MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION 发明人 KUMAR, NALIN
分类号 C23C14/34;C23C14/56;H01J37/34;H01L39/24 主分类号 C23C14/34
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