发明名称 End terminated high power chip resistor assembly
摘要 An end terminated high power chip resistor-printed circuit board assembly (9) suitable for use in applications requiring miniature surface mount resistors capable of high power dissipation. An end terminated high power chip resistor (8) is constructed by coating a portion of the bottom of an end terminated chip resistor with a conductive plate (12). The end terminated high power chip resistor (8) is mounted to a printed circuit board having at least one via (23) lined with metal (20) wherein the conductive plate (12) is positioned above the via (23) lined with metal (20). A heat sink (16) is mounted to the printed circuit board opposite to the side to which the end terminated high power chip resistor (8) is mounted and is in contact with the metal (20) lining via (23).
申请公布号 US5179366(A) 申请公布日期 1993.01.12
申请号 US19910720034 申请日期 1991.06.24
申请人 MOTOROLA, INC. 发明人 WAGNER, ROBERT
分类号 H01C1/084;H01C17/00;H05K1/02;H05K3/34;H05K3/42 主分类号 H01C1/084
代理机构 代理人
主权项
地址