发明名称 |
Method of manufacturing circuit structure by insert molding of electric and/or optical transmission medium |
摘要 |
A method of manufacturing a circuit structure where the electric and/or optical transmission medium or media include at least one of an optical signal transmission medium, an electric signal transmission medium, and an electric power transmission medium. The transmission media are insert-molded in plastics which is a housing for electronic and electric devices and parts. The circuit structure serves both for conductive circuits and housing so that the electronic and electric devices and parts can be wired and mounted at high density.
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申请公布号 |
US5179601(A) |
申请公布日期 |
1993.01.12 |
申请号 |
US19910785000 |
申请日期 |
1991.10.30 |
申请人 |
HITACHI, LTD. |
发明人 |
GOTOH, MASAO;IIDA, MAKOTO;WARAGAI, KENICHI;YANOKURA, YONEZO;SATO, MASAKI |
分类号 |
B29C45/16;H05K1/00;H05K1/02;H05K3/00;H05K3/20 |
主分类号 |
B29C45/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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