发明名称 CONNECTING PROCESS OF LEAD WIRE
摘要 The method for connecting the fine lead wires of the electronic circuit device to a main body comprises soldering each fine lead wire (10a-10c) end of the lead wire (10) and each strip piece (15), mounting the strip pieces (15) into the grooves (20a-20n) of a stiffener (20) connected to a printed circuit cable (40) and fixing the lead wire (10) mounted into the grooves of the stiffener (20) by using a fixation plate (30), thereby connecting the fine lead wires to the PCC (40) without the damage of the fine lead wire.
申请公布号 KR930000198(B1) 申请公布日期 1993.01.11
申请号 KR19900011078 申请日期 1990.07.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JIN - SOK
分类号 H01R4/00;(IPC1-7):H01R4/00 主分类号 H01R4/00
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